Curved lead configurations

A microelectronic lead assembly for connecting first and second microelectronic elements, said lead assembly comprising:

• a structure defining a lead-bearing surface;
• a terminal end for connection to the first microelectronic element, said terminal end disposed on said lead-bearing surface and fixed to said structure;
• a tip end for connection to the second microelectronic element, said tip end being releasably connected to said lead-bearing surface, said tip end further being spaced apart on said lead-bearing surface from said terminal end;
• and
• a curved lead connecting said tip end and said terminal end, said curved lead having a bulge at one of said ends, said lead being substantially tangent to said bulge.

A microelectronic lead assembly for connecting first and second microelectronic elements, said lead assembly comprising:

• a structure defining a lead-bearing surface;
• a terminal end for connection to the first microelectronic element, said terminal end disposed on said lead-bearing surface and fixed to said structure;
• a tip end for connection to the second microelectronic element, said tip end being releasably connected to said lead-bearing surface, said tip end also being spaced apart on said lead-bearing surface from said terminal end along an offset axis;
• a generally S-shaped lead connecting said tip end and said terminal end, said S-shaped lead having a first curve in a first direction and a second curve in a second direction opposite said first direction, said first curve having a curve angle of at least 90 degrees as measured by an angle that a vector tangent to the lead entering the curve must be rotated to have a direction of a vector tangent to the lead exiting the curve.

A microelectronic lead assembly for connecting first and second microelectronic elements, said lead assembly comprising:

• a structure defining a lead-bearing surface;
• a tip end for connection to the second microelectronic element, said tip end being releasably connected to said lead-bearing surface;
• an annular terminal structure for connection to the first microelectronic element, said terminal structure disposed on said lead-bearing surface surrounding and substantially concentric with said tip end and fixed to said structure;
• a plurality of leads interconnecting said tip end and said terminal structure.

A microelectronic lead assembly for connecting first and second microelectronic elements, said lead assembly comprising:

• a structure defining a lead-bearing surface;
• a terminal end for connection to the first microelectronic element, said terminal end disposed on said lead-bearing surface and fixed to said structure;
• a tip end for connection to the second microelectronic element, said tip end being releasably connected to said lead-bearing surface;
• and
• a lead interconnecting said tip end and said terminal end, said sheet-like lead having a peripheral edge and defining a slot with a plurality of branches, a first one of said branches passing between said tip end and said terminal end and having an opening at said peripheral edge.