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US 5,859,469 AGranted
Use of tungsten filled slots as ground plane in integrated circuit structure
AssigneeAdvanced Micro Devices, Inc.
InventorD. Michael Rynne
Life of this patent
Estimating the term…
Abstract
A semiconductor device having the base and collector surrounded by a continuous tungsten filled slot as ground plane. The portion of the tungsten filled slot over the buried layer extends beyond the surface of the buried layer and the portion of the tungsten filled slot not over the buried layer extends beyond the interface between the epitaxial layer and the substrate.
Claims5
A semiconductor device comprising:
- a substrate;
- an epitaxial region formed on said substrate;
- base and collector regions formed in the epitaxial region;
- a buried layer formed at an interface between said substrate and said epitaxial region;
- tungsten filled slots of a continuous structure surrounding the base and the collector regions serving as ground planes such that said slots extend to said substrate beyond said interface.
2 more elements
Dependencies are inferred from the claim text.