Circuit and method for configuring a redundant bond pad for probing a semiconductor

An integrated device comprising:

• a first bond pad in selective electrical connection with a first conductive path;
• a second bond pad in selective electrical connection with a second conductive path;
• and
• a selection circuit coupled to said first and second conductive paths, wherein said selection circuit operable to receive an enable signal that has a first value during a first operational mode of said integrated device and a second value during a second operational mode of said integrated device, and wherein said selection circuit is operable to couple said first bond pad to said first conductive path in response to said first value;
• said selection circuit further operable to couple said second bond pad to said second conductive path in response to said second value.

A semiconductor wafer comprising:

• a plurality of semiconductor dies, each die having a first area and a second area, each die comprising:
• a first bond pad in said first area;
• a second bond pad in said second area;
• a test signal conductive path;
• a circuit;
• and
• a testing device coupled to said first bond pad, said second bond pad, said test signal conductive path, and said circuit, wherein said testing device is operable to allow transmission of signals between said circuit and said first bond pad, and said testing device is further operable to establish the transmission of signals between said circuit and said second bond pad upon a test signal sent by way of said test signal conductive path.

A switching device for an operations circuit comprising:

• a first conductive path coupled to said operations circuit;
• a second conductive path coupled to said operations circuit;
• a first bond pad coupled to said first conductive path;
• a second bond pad coupled to said second conductive path;
• a selection circuit coupled to a third bond pad, said first conductive path, and to said second conductive path, wherein said selection circuit is configured to allow grounding of said second conductive path during a first mode of operation of said operations circuit and grounding of said first conductive path during a second mode of operation of said operations circuit.

A switching assembly for an operations circuit, comprising:

• an output node coupled to said operations circuit;
• a primary input selectively coupled to said output node;
• a test input selectively coupled to said output node of said assembly;
• and
• a selection mechanism electrically interposed between said inputs and said output.

A testing circuit for an operations circuit comprising:

• a main output terminal coupled to a main input terminal;
• a first electrically grounding device interposed between said main output terminal and said main input terminal;
• a test output terminal coupled to a test input terminal;
• a second electrically grounding device interposed between said test output terminal and said test input terminal;
• and
• a test-mode-enable input terminal coupled to said first and second electrically grounding devices, wherein said test-mode-enable input terminal is configured to selectively drive said electrically grounding devices.