Semiconductor device leadframe die attach pad having a raised bond pad
AssigneeAllegro MicroSystems, LLC
InventorJay J Gagnon
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a lead frame assembly having a die attach pad with a die secured by a die bonding material. A portion of the die bonding material may flow out from between the die and the die attach pad to form a squash out layer. A raised bond pad is at least partially in the squash out layer area and extends upward from said die attach pad sufficient to be above the squash out layer. A bond wire has one end secured to a ground terminal on the die and the other end to the raised bond pad. The whole structure is encapsulated in a plastic package.
Claims10
A semiconductor device lead frame assembly adapted to be encapsulated by a plastic package, comprising:
- a die attach pad,
- inner bond fingers spaced apart from a die attach pad,
- said lead frame having dual gauge metal portions, said die attach pad being in a portion with reduced thickness,
- said die attach pad having its thickness so dimensioned that the bottom of said die attach pad does not extend through said plastic package,
- said die attach pad adapted to allow a die to be secured to said die attach pad by a die bonding material, a portion of said die bonding material which flows out from between said die and said die attach pad to form a squash out layer covering a first area of said die attach pad, and
- a raised bond pad, at least partially in said first area, extending upward from said die attach pad sufficient to be above said squash out layer.
A semiconductor device, comprising:
- a plastic package,
- a lead frame having a die attach pad and inner bond fingers spaced apart from said die attach pad,
- said lead frame having dual gauge metal portions, said die attach pad being in a portion with reduced thickness,
- said die attach pad having its thickness so dimensioned that the bottom of said die attach pad does not extend through said plastic package,
- a die secured to said die attach pad by a die bonding material, a portion of said die bonding material which flows out from between said die and said die attach pad to form a squash out layer covering a first area of said die attach pad,
- a raised bond pad at least partially in said first area extending upward from said die attach pad sufficient to be above said squash out layer,
- a bond wire having one end secured to said die and the other end to said raised bond pad, and
- said plastic package encapsulating said die, die attach pad, raised bond pad and bond wire.
Dependencies are inferred from the claim text.