US 5,859,181 A · Siloxane polymide and heat-resistant adhesive containing the same

Abstract

A solvent-soluble siloxane polyimide comprising a copolymer obtained by reaction of a diamine compound mixture comprising a diaminopolysiloxane and an alicyclic diamine with an aromatic tetracarboxylic acid anhydride, followed by polyimidization reaction of the resulting polyamic acid forms a heat-resistant adhesive by adding an epoxy resin, a diamine-based curing agent and an organic solvent thereto, The formed adhesives show a distinguished heat-resistant adhesiveness when the resulting siloxane polyimide soluble in ordinary organic solvents is used as a main component of the adhesive for bonding between a base material and a copper foil of a flexible printed substrate. By further addition of a fluorinated resin to the heat-resistant adhesive, the adhesiveness can be more improved.

Claims11

Dependent claims

A process for producing a solvent-soluble siloxane polyimide, which comprises reacting a diamine compound mixture comprising a diaminopolysiloxane represented by the following general formula:

##STR3## wherein R represents a divalent hydrocarbon group having 2 to 6 carbon atoms;
R.sub.1 to R.sub.4 each independently represent a lower alkyl group having 1 to 5 carbon atoms and a phenyl group;
and n is an integer of 0 to 30, and an alicyclic diamine having at least one cyclohexane ring with an aromatic tetracarboxylic acid dianhydride in an equimolar amount and polyimidizing the resulting polyamic acid.

Dependencies are inferred from the claim text.

Siloxane polymide and heat-resistant adhesive containing the same

Life of this patent

Siloxane polymide and heat-resistant adhesive containing the same

Life of this patent

Abstract

Claims11