Adhesive of epoxy resin, carboxylated rubber aromatic amine and dicyandiamide
AssigneeMitsui Chemicals, Inc.
InventorsToshikazu Furihata, Akio Ikeda, Wataru Soejima
Life of this patent
Estimating the term…
Abstract
There is provided an adhesive composition for use in a flexible printed circuit board, comprising: (a) an epoxy resin having substantially at least two epoxy groups per molecule; (b) at least one selected from carboxyl group-containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber; and (c) a curing agent which comprises aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65.ltoreq.(c1)/(c2).ltoreq.99/1.
Claims10
An adhesive composition for use in a flexible printed circuit board, comprising:
- (a) an epoxy resin having substantially at least two epoxy groups per molecule;
- (b) 33 to 200 parts by weight based on 100 parts by weight of the epoxy resin (a) of at least one compound selected from carboxyl group-containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber;
- and
- (c) a curing agent which comprises an aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65.ltoreq.(c1)/(c2).ltoreq.99/1, wherein the total amount of aromatic amine (c1) and dicyandiamide (c2) is used in an equivalent ratio of 0.7:1 to 1.3:1 with respect to the epoxy resin (a).
An adhesive composition for use in a flexible printed circuit board, comprising:
- (a) an epoxy resin having substantially at least two epoxy groups per molecule in at least 98% by weight of the total amount of molecules;
- (b) 33 to 200 parts by weight based on 100 parts by weight of the epoxy resin (a) of at least one compound selected from carboxyl group-containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber;
- (c) a curing agent which comprises an aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65.ltoreq.(c1)/(c2).ltoreq.99/1, wherein the total amount of aromatic amine (c1) and dicyandiamide (c2) is used in an equivalent ratio of 0.7:1 to 1.3:1 with respect to the epoxy resin (a);
- (d) a curing accelerator;
- and
- (e) an inorganic filler and a heat deterioration inhibitor.
Dependencies are inferred from the claim text.