Thermosetting resin composition and two-parts composite body thereof with silcone rubber

Abstract

Disclosed is a novel thermosetting resin composition suitable for the preparation of an integrally molded two-parts composite body consisting of a first part of a cured silicone rubber and a second part of a cured thermosetting resin without intervention of an adhesive layer at the interface. The thermosetting resin composition comprises: (a) 100 parts by weight of an unsaturated polyester resin; (b) from 20 to 50 parts by weight of an ethylenically unsaturated polymerizable compound such as diallyl phthalate; (c) from 5 to 30 parts by weight of an epoxy resin; (d) from 2 to 20 parts by weight of a melamine resin; (e) from 0.1 to 2 parts by weight of a radical-reactive curing agent which is an organic peroxide; and (f) from 0.1 to 2 parts by weight of an acidic catalyst such as aromatic sulfonic acid derivatives.

Dependencies are inferred from the claim text.