Organosilicon-containing compositions capable of rapid curing at low temperature
AssigneeJohnson Matthey PLC
InventorMy N. Nguyen
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Abstract
Described is an organosilicon-containing composition suitable for use as an adhesive and capable of rapid curing at low temperature. The composition comprises about 10 to 80 wt. % of an organic compound component and about 20 to 90 wt. % of one of boron nitride or silver. The organic compound component comprises the reaction product of about 40 to 90 wt. % of the reaction product of cyclic olefin and cyclic siloxane and about 10 to 60 wt. % rubber in liquid form.
Claims11
An organosilicon-containing composition suitable for use as an adhesive and capable of rapid curing at low temperature comprising about 10 to 80 wt. % of an organic compound component and about 20 to 90 wt. % of one of boron nitride and silver;
- said organic compound component comprising the reaction product of about 40 to 90 wt. % reaction product of cyclic olefin and cyclic siloxane and about 10 to 60 wt. % rubber in liquid form.
Dependencies are inferred from the claim text.