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AssigneeCiba Specialty Chemicals Corporation
InventorsJames Edward Hoge, Teruko Uchimi Miyazaki, Rajan Eadara
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The present invention pertains to a one component curable epoxy resin composition which is storage-stable at ambient temperature and which maintains a post-cured high glass transition temperature (Tg) of above 130.degree. C. and a low coefficient of thermal expansion (CTE) of less than 1.76.times.10.sup.-5 cm/cm/.degree.C. over a temperature range of -30.degree. to 125.degree. C., and thus finds practical utility in tooling applications. The epoxy resin composition comprises an epoxy resin or mixture thereof, a multifunctional epoxy resin diluent, a boron trichloride amine complex, and at least one filler selected from the group consisting of a silica or a silicate. The invention also relates to the cured product.
A semi-solid curable epoxy resin composition which is storage-stable at ambient temperature and which maintains, when cured, a post-cured high glass transition temperature (Tg) of above 130.degree. C. and a low coefficient of thermal expansion (CTE) of less than 1.7.times.10.sup.-5 cm/cm.degree.C. over a temperature range of -30.degree. to 125.degree. C., which composition comprises
A cured epoxy resin composition having a glass transition temperature (Tg) of above 130.degree. C. and a coefficient of thermal expansion (CTE) of less than 1.7.times.10.sup.-5 cm/cm/.degree.C. over a temperature range of -30.degree. to 125.degree. C., which comprises the cured product of a semi-solid composition comprising
Dependencies are inferred from the claim text.