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AssigneeNitto Denko Corporation
InventorsToshihiko Omote, Yasuhito Funada
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A circuit substrate having an insulating layer comprising a polyimide resin on a metal foil substrate, wherein the polyimide resin is a polyimide resin obtained by the reaction of (A) aromatic diamines comprising (a) 1,3-bis(4-aminophenoxy)benzene and (b) 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl and (B) aromatic tetracarboxylic acid dianhydrides comprising (a) 3,4,3',4'-biphenyltetracarboxylic acid dianhydride and (b) 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride. The circuit-formed substrate has a desired circuit comprising a conductive layer on the circuit substrate. The polyimide resin has a low hygroscopic property and thus the substrate is excellent in the dimensional stability and does not cause warping even when the humidity in the environmental atmosphere is changed.
A circuit substrate comprising a metal foil substrate and an insulating layer comprising a polyimide resin formed on the metal foil substrate, wherein said polyimide resin is a polyimide resin obtained by the reaction of
A circuit substrate comprising a metal foil substrate and an insulating layer comprising a polyimide resin formed on the metal foil substrate, wherein said polyimide resin is a polyimide resin obtained by reacting, in the presence of a photosensitive agent, a polyimide precursor obtained from
A method of producing a circuit substrate having an insulating layer comprising a polyimide resin by forming a coating film of a photosensitive polyimide resin precursor on a metal foil substrate, light-exposing, heating after the light-exposure, developing, and then imidating the precursor by heating, wherein said photosensitive polyimide resin precursor is obtained by compounding polyamic acid obtained by the reaction of
A circuit-formed suspension substrate comprising a metal foil substrate, an insulating layer comprising a polyimide resin formed on the metal foil substrate, and a pattern circuit comprising a conductive layer formed on the insulating layer, wherein said polyimide resin is a polyimide resin obtained by the reaction of
A circuit-formed suspension substrate comprising a metal foil substrate, an insulating layer comprising a polyimide resin formed on the metal foil substrate, and a pattern circuit comprising a conductive layer formed on the insulating layer, wherein said polyimide resin is a polyimide resin obtained by reacting, in the presence of a photosensitive agent, a polyimide resin precursor obtained from
A method of producing a circuit-formed suspension substrate by forming a coating film comprising a photosensitive polyimide resin precursor on a metal foil substrate, light-exposing, heating after the light-exposure, developing, imidating the precursor by heating to form a circuit substrate having an insulating layer comprising a polyimide resin, and then forming a pattern circuit comprising a conductive layer on the insulating layer, wherein said photosensitive polyimide resin precursor is obtained by compounding a polyamic acid obtained by the reaction of
Dependencies are inferred from the claim text.