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US 5,858,481 AGranted
Electronic circuit substrate
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTetsuo Fukushima, Koichi Yoshida, Kenichiro Suetsugu
Life of this patent
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Abstract
An electronic circuit substrate is sealed with a sealing material made of thermoplastic resin having a thermal-expansion coefficient close to that of a ceramic substrate by a compound filler dispersedly mixed in the sealing material. The filler includes at least two of milled fiber, glass fiber, and flaked filler.
Claims12
An electronic substrate comprising:
- a substrate made of ceramic and supporting one or more electronic components;
- a thermoplastic resin attached to the substrate for sealing a surface of the electronic circuit substrate and the electronic component;
- the thermoplastic resin having a thermal-expansion coefficient approximating a thermal-expansion coefficient of the substrate made of ceramic;
- and
- a compound filler mixed in the thermoplastic resin, said compound filler is present in an amount of 20-50 percent with respect to the weight of said thermoplastic resin and including a flaked metal oxide and a glass fiber of at least 20% by weight of the thermoplastic resin to provide the thermal-expansion coefficient.
2 more elements
In an electronic circuit substrate made of ceramic and sealed with a resin, the improvement comprising:
- a sealing compound of a liquid crystal polymer and a filler mixture in an amount of 20 to 50 weight percent with respect to a weight of the liquid crystal polymer, the filler mixture including a milled glass fiber, a glass fiber, and a flaked filler, the sealing compound having a thermal-expansion coefficient close to a thermal-expansion coefficient of the ceramic substrate.
Dependencies are inferred from the claim text.