Process for bonding semiconductor chip

A process for bonding a semiconductor chip to a substrate comprising:

• providing a semiconductor chip including spaced aluminum bond pads;
• forming a gold bump having a bump height directly on each of the aluminum bond pads of said semiconductor chip thereby forming a flip chip;
• providing a substrate having a chip mounting portion including spaced lead fingers;
• providing a screen having a first thickness and an opening;
• placing the screen on the substrate such that the opening is placed over the chip mounting portion of the substrate;
• dispensing insulating epoxy into said opening in order to dot the insulating epoxy on the substrate;
• blading the epoxy with a printing blade in order to form an epoxy layer across said opening, said layer having a uniform thickness on the substrate, said uniform thickness being thicker than the bump height;
• removing the screen from the substrate;
• placing the flip chip on said substrate and into the epoxy layer such that each gold bump of the chip is brought into electrical contact with a corresponding lead finger of the substrate while preventing formation of voids in the epoxy layer;
• thermally compressing the chip and substrate together through thermocompression bonding in order to bond the chip to the substrate by the epoxy layer;
• and
• then permanently curing the epoxy layer.