Method of and apparatus for dressing polishing cloth
AssigneeEbara Corporation
InventorsHirokuni Hiyama, Norio Kimura, Tomoyuki Yahiro
Life of this patent
Estimating the term…
Abstract
A polishing cloth is dressed between polishing processes each for polishing a workpiece such as a semiconductor wafer. The polishing cloth is dressed while supplying a dressing liquid such as water during a dressing process, and an abrasive liquid for polishing a workpiece is supplied to the polishing cloth for a predetermined period of time prior to a polishing process. The predetermined period of time may be present within the dressing process and immediately precedes the polishing process, and the dressing process may be carried out while supplying the abrasive liquid to the polishing cloth. Alternatively, the predetermined period of time may be present between the dressing process and the polishing process.
Claims14
A method of dressing a polishing cloth between a preceding polishing process for polishing a workpiece and a subsequent polishing operation for polishing another workpiece, said method comprising the steps of:
- dressing said polishing cloth with a dressing element while supplying a dressing liquid to said polishing cloth;
- and
- supplying an abrasive liquid for polishing said another workpiece to said polishing cloth for a predetermined period of time prior to said subsequent polishing process;
- said dressing liquid being of a different composition than said abrasive liquid and being capable of diluting said abrasive liquid.
A method of manufacturing a semiconductor wafer, said method comprising
- dressing a polishing cloth with a dressing element while supplying a dressing liquid to a polishing cloth;
- polishing a semiconductor wafer by a polishing apparatus;
- and
- supplying an abrasive liquid for polishing said semiconductor wafer to said polishing cloth for a predetermined period of time prior to said polishing process;
- said dressing liquid being of a different composition than said abrasive liquid and being capable of diluting said abrasive liquid.
An apparatus for dressing a polishing cloth between polishing processes, each for polishing a workpiece, said apparatus comprising:
- a dressing head for holding a dressing element to dress a polishing cloth;
- a dressing liquid supply nozzle for supplying a dressing liquid used to dress the polishing cloth to the polishing cloth during a dressing process;
- an abrasive liquid supply nozzle separate from said dressing liquid supply nozzle for supplying an abrasive liquid used to polish a workpiece to the polishing cloth during a polishing process;
- and
- the dressing liquid being of a different composition than the abrasive liquid and being capable of diluting the abrasive liquid;
- and
- means for controlling the supply of abrasive liquid from said abrasive liquid supply nozzle to ensure that the abrasive liquid is supplied to the polishing cloth for a predetermined period of time prior to the polishing process.
An apparatus for manufacturing a semiconductor wafer, said apparatus comprising:
- a polishing apparatus for polishing a semiconductor wafer;
- a dressing head for holding a dressing element to dress a polishing cloth;
- a dressing liquid supply nozzle for supplying a dressing liquid used to dress the polishing cloth to the polishing cloth during a dressing process;
- an abrasive liquid supply nozzle separate from said dressing liquid supply nozzle for supplying an abrasive liquid used to polish the semiconductor wafer to the polishing cloth during a polishing process;
- and
- the dressing liquid being of a different composition than said abrasive liquid and being capable of diluting said abrasive liquid;
- and
- means for controlling the supply of abrasive liquid from said abrasive liquid supply nozzle to ensure that the abrasive liquid is supplied to the polishing cloth for a predetermined period of time prior to the polishing process.
Dependencies are inferred from the claim text.