Process and apparatus for forming ball bumps
AssigneeNippon Steel Corporation
InventorsHiroshi Hoshiba, Kohei Tatsumi, Masashi Konda, Yoji Kawakami
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AssigneeNippon Steel Corporation
InventorsHiroshi Hoshiba, Kohei Tatsumi, Masashi Konda, Yoji Kawakami
Estimating the term…
A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.
A process of removing excess small balls, comprising:
An apparatus for removing excess small balls, comprising:
A process of removing excess small balls, comprising:
An apparatus for removing excess small balls, comprising:
Dependencies are inferred from the claim text.