US 5,857,050 A · Packaging for optoelectronic device

Abstract

A package for an optoelectronic device having an optical fiber in communication therewith. The parts of the package are generally of polymer material, preferably engineering thermoplastic, which is assembled to the fiber having the device mounted on a printed circuit board type material, FR4. The adhesion process of the individual parts of the package is done typically through a solvent bonding or an epoxy curing process that is done at room temperature, thereby eliminating the drawbacks of soldering at high temperature which has the attendant disadvantage of built in stress and thermal expansion resulting in misalignment of the individual parts. The related packaging technique greatly reduces the requirements of active alignment of the fiber to the device in the packaging of the device and fiber. Accordingly, the overall cost of the device is reduced by virtue of the reduced cost of the parts of the package as well as the process for fabrication of the package.

Claims15

Dependent claims

A package for an optoelectronic detector comprising:

a substrate having an optoelectronic detector mounted thereon;
a polymer housing having a first end and a second end and a substantially cylindrical portion between said first end and said second end;
an optical fiber mounted in said cylindrical portion of said optical fiber having a first end and a second end where said first end is in optical communication with said optoelectronic detector;
and
a spacer mounted between said first end of said housing and said substrate for effecting alignment of said fiber to said detector in at least one direction, wherein said substrate, said spacer, and said housing are adhesively fixed.

2 more elements

Dependencies are inferred from the claim text.

Packaging for optoelectronic device

Life of this patent

Packaging for optoelectronic device

Life of this patent

Abstract

Claims15