High speed single chip digital video network apparatus
AssigneeLSI Logic Corporation
InventorsMichael D. Rostoker, John P. Daane, Sanjay Desai, D. Tony Stelliga
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AssigneeLSI Logic Corporation
InventorsMichael D. Rostoker, John P. Daane, Sanjay Desai, D. Tony Stelliga
Estimating the term…
A high speed digital video network apparatus is implemented on a single integrated circuit chip, and includes a network protocol processing system interconnection, compression/decompression circuits, and encoder/decoder circuits. The interconnection includes a packet conversion logic which converts between a network protocol, such as Asynchronous Transfer Mode (ATM) packets, and the data protocol used to handle large data streams, such as Motion Picture Experts Group (MPEG) packets. The interconnection further includes a Virtual Channel Memory (VCM) for storing ATM cells for segmentation and reassembly, a Direct Memory Access (DMA) controller for connecting the VCR to the compression/decompression circuits, a Parallel Cell Interface (PCI) for connecting the VCM to an ATM network, a Pacing Rate Unit (PCU) for automatically reducing the maximum transmission rate in response to a sensed congestion condition in the network, and a Reduced Instruction Set Computer (RISC) microprocessor for controlling the DMA controller and transfers between the memory, a host and the ATM network, for performing segmentation and reassembly of Conversion Sublayer Payload Data Units (CD-PDUs), and for performing conversion between the ATM Protocol and the MPEG protocol. The compression/decompression and decoder/encoder circuits may utilize MPEG to compress digitized images and motion video into compact data streams that can be moved across networks with bandwidths too narrow to accommodate the uncompressed data. The operating program for the RISC microprocessor is stored in a volatile Instruction Random Access Memory (IRAM) in the form of firmware which can be downloaded at initialization.
A single chip digital video network apparatus, comprising on a single semiconductor substrate:
Dependencies are inferred from the claim text.