Method for continuous, non lot-based integrated circuit manufacturing

A method in an integrated circuit (IC) device manufacturing process for tracking multiple lots of IC devices through back-end test steps in the process, the method comprising:

• programming each of the IC devices with a unique fuse identification (ID);
• for each of the back-end test steps, reading the fuse ID of each of the IC devices in each of the multiple lots;
• advancing the IC devices in the multiple lots through the back-end test steps in the manufacturing process in a substantially continuous manner;
• generating data related to the advancement of each of the IC devices through the back-end test steps;
• and
• associating the data generated for each of the IC devices with the fuse ID of its associated IC device so the multiple lots of IC devices can be tracked through the back-end test steps.

A method of manufacturing integrated circuit (IC) devices from semiconductor wafers, the method comprising:

• providing a plurality of semiconductor wafers in multiple lots;
• fabricating a plurality of IC's on each of the wafers;
• causing each of the IC's on each of the wafers to permanently store a substantially unique identification (ID) code;
• separating each of the IC's on each of the wafers from its wafer to form one of a plurality of IC dice;
• assembling each of the IC dice into an IC device;
• reading the ID code from the IC in each of the IC devices;
• testing each of the IC devices;
• while testing the IC devices:
• advancing the IC devices from the multiple lots of semiconductor wafers through at least one test step in a substantially continuous manner;
• generating data related to the advancement of each of the IC devices through the test step;
• and
• associating the data generated for each of the IC devices with the ID code of the IC in its associated IC device so the IC devices from the multiple lots can be tracked through the test step.

A method in an integrated circuit (IC) device manufacturing process for correlating variables related to the process with variables related to the performance of IC devices as they advance through the process, the method comprising:

• providing a plurality of IC devices from multiple lots with permanently stored, substantially unique identification (ID) codes;
• reading the ID code from each of the IC devices;
• advancing the IC devices from the multiple lots through at least one step in the manufacturing process in a substantially continuous manner;
• while the IC devices advance through the step in the manufacturing process, generating data related to process variables associated with the step in the process;
• generating data related to variables associated with the performance of at least some of the IC devices as they advance through at least one step in the manufacturing process;
• and
• associating the process variable-related data and the performance variable-related data generated for each of the IC devices with the ID code of the IC device associated with the data in order to correlate the process variables with the performance variables.

A method of manufacturing Single In-line Memory Modules (SIMM's) from semiconductor wafers, the method comprising:

• providing a plurality of semiconductor wafers in multiple lots;
• fabricating a plurality of IC's on each of the wafers;
• causing each of the IC's on each of the wafers to permanently store a substantially unique identification (ID) code;
• separating each of the IC's on each of the wafers from its wafer to form one of a plurality of IC dice;
• assembling a plurality of SIMM's from the IC dice;
• reading the ID codes from the IC dice in each of the SIMM's;
• testing each of the IC dice in each of the SIMM's;
• while testing the IC dice:
• advancing the IC dice and the SIMM's through at least one test step in a substantially continuous manner;
• generating data related to the advancement of the IC dice through the test step;
• and
• associating the data generated for each of the IC dice with the ID code of the IC in its associated IC die so the IC dice from the multiple lots can be tracked through the test step.

A method of manufacturing Dual In-line Memory Modules (DIMM's) from semiconductor wafers, the method comprising:

• providing a plurality of semiconductor wafers in multiple lots;
• fabricating a plurality of IC's on each of the wafers;
• causing each of the IC's on each of the wafers to permanently store a substantially unique identification (ID) code;
• separating each of the IC's on each of the wafers from its wafer to form one of a plurality of IC dice;
• assembling a plurality of DIMM's from the IC dice;
• reading the ID codes from the IC dice in each of the DIMM's;
• testing each of the IC dice in each of the DIMM's;
• while testing the IC dice:
• advancing the IC dice and the DIMM's through at least one test step in a substantially continuous manner;
• generating data related to the advancement of the IC dice through the test step;
• and
• associating the data generated for each of the IC dice with the ID code of the IC in its associated IC die so the IC dice from the multiple lots can be tracked through the test step.