Micro-electronic assembly including a flip-chip mounted micro-device and method

A method of manufacturing a micro-electronic assembly, said method comprising:

• a) forming a substrate from a substrate material such that said substrate includes an outer surface configuration which defines an aperture within a first surface of the substrate;
• b) forming electrically conductive means on said first surface;
• c) providing a micro-device including a die and a transducer, the die including an active surface supporting a component which forms part of the overall transducer and projects outwardly from said active surface and electrical connecting means on said active surface for electrically interfacing the overall micro-device;
• and
• d) supporting said micro-device on the first surface of said substrate such that only said component extends at least partially into the aperture and so that said electrical connecting means is electrically engaged with said electrically conductive means.