Multilayer semiconductor device having high packing density
AssigneeSemikron Elektronik GmbH & Co. KG
InventorHeinrich Heilbronner
Life of this patent
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Abstract
A semiconductor power module has semiconductor components mounted on a substrate. The semiconductor components are in electrical contact with the substrate. Internal circuit wiring is achieved by using one or more flexible circuit boards. The flexible circuit board(s) contact the semiconductor components and also provide external connection elements. Hermetical encapsulation is achieved by lamination, and height equalization of the different circuit regions is achieved by using geometrically preformed prepregs in conjunction with the flexible circuit board and the substrate.
Claims10
A semiconductor power module, comprising:
- an electrically isolating substrate;
- a layer of electrically conducting material on each of two opposing surfaces of said substrate;
- at least one semiconductor component, having a first face and a second face;
- said first face of said semiconductor component being in electrical contact and thermal contact with one of said layers of electrically conducting material;
- said second face of said semiconductor component being in electrical contact with a flexible circuit board at a contact point;
- and
- at least one structured intermediate isolation layer, having at least one opening effective to allow said semiconductor element to electrically contact said flexible circuit board at said contact point, wherein said isolation layer is between said substrate and said flexible circuit board.
Dependencies are inferred from the claim text.