Microelectronic assembly for connection to an embedded electrical element, and method for forming same

A microelectronic assembly comprising:

• a substrate formed of polymeric laminate and having a face, said substrate defining a via having a via opening at the face and further defining a component cavity at the face spaced apart from the via, said substrate further comprising an antenna disposed within the substrate and comprising a terminal at the via;
• an integrated circuit component received in the component cavity;
• a metallic lead affixed to the face, said metallic lead being electrically connected to the integrated circuit component, said metallic lead comprising a leg dependent from the metallic lead and extending into the via;
• and
• a conductive body within the via electrically connecting the leg and the terminal.

A microelectronic assembly comprising:

• a substrate formed of polymeric laminate and having a face, said substrate defining a recess, a via having a via opening at the face, and a component cavity at the face spaced apart from the via;
• an antenna disposed within the substrate and comprising a terminal at the via;
• an integrated circuit component received in the component cavity;
• a metallic lead affixed to the face, said metallic lead being electrically connected to the integrated circuit component and formed of a metallic plate that is received in the recess, said metallic lead including a leg dependent from the metallic lead and extending substantially perpendicular to the metallic lead into the via;
• and
• a conductive body within the via electrically connecting the leg and the terminal.