Transition and interconnect structure for a cryocable

An electrical interconnect for passing signals from cryogenic circuitry to ambient circuitry comprising

• a first electrical conductor,
• a dielectric adjacent to and operatively contacting the first electrical conductor,
• a second electrical conductor adjacent to and operatively contacting the dielectric,
• the second electrical conductor having a thickness from about 6 microns to about 20 microns,
• the interconnect operatively connectable between cryogenic circuitry and ambient circuitry,
• the cryogenic and ambient circuitry having a temperature difference,
• the interconnect having a heat flux when connected between the cryogenic circuitry and the ambient circuitry,
• the heat flux being less than about one-tenth of a Watt when the temperature difference between the cryogenic circuitry and the ambient circuitry is at least about two hundred degrees Celsius,
• the interconnect having an insertion loss, and
• the insertion loss being less than about one decibel.

An electrical interconnect for passing millimeter and microwave signals from cryogenic circuitry to ambient circuitry comprising

• a first electrical conductor,
• a dielectric adjacent to and operatively contacting the first electrical conductor,
• a second electrical conductor adjacent to and operatively contacting the dielectric and having a thickness from about 6 microns to about 20 microns,
• the interconnect characterized in that when the interconnect is operatively connected between cryogenic circuitry and ambient circuitry a heat flux flowing through the interconnect between the cryogenic circuitry and the ambient circuitry is less than about one-tenth of a Watt when a temperature difference occurs between the cryogenic circuitry and the ambient circuitry of at least about two hundred degrees Celsius, and the interconnect characterized further in that an insertion loss associated therewith is less than about one decibel.

An electrical interconnect for passing millimeter and microwave signals from cryogenic circuitry to ambient circuitry comprising

• a first electrical conductor,
• a dielectric adjacent to and operatively interfaced with the first electrical conductor,
• a second electrical conductor adjacent to and operatively interfaced with the dielectric and having a thickness from about 6 microns to about 20 microns,
• the interconnect characterized in that when the interconnect is connected between the cryogenic circuitry and the ambient circuitry, a heat flux flowing through the interconnect between the cryogenic circuitry and the ambient circuitry is less than about one Watt when a temperature difference occurs between the cryogenic circuitry and the ambient circuitry of at least about two hundred degrees Celsius, and the interconnect characterized further in that an insertion loss associated therewith is less than about one decibel.