Integrated circuitry having a pair of adjacent conductive lines

Integrated circuitry comprising:

• a pair of spaced lines, the lines comprising ends;
• and
• an overlying material over the pair of lines, a top sealed elongated void being beneath the overlying material and between the lines, the void having an end, the overlying material being at the end of the void, the overlying material at the end of the void being recessed relative to the ends of the lines.

Integrated circuitry comprising:

• a pair of spaced electrically conductive elongated lines, the lines comprising ends;
• and
• the pair of conductive lines being encapsulated with an electrically insulative material, a top sealed elongated void being provided beneath the electrically insulative material and between the lines, the void having an end, a portion of the insulating material being at the end of the void, the portion of the insulating material at the end of the void not having a retrograde profile relative to the ends of the lines.

Integrated circuitry comprising:

• a pair of spaced electrically conductive elongated lines, the lines comprising ends;
• and
• the pair of conductive lines being encapsulated with an electrically insulative material, a top sealed elongated void provided beneath the electrically insulative material and between the lines, the void having an end, the insulating material being at the end of the void, the insulating material at the end of the void being recessed relative to the ends of the lines.

Integrated circuitry comprising:

• a pair of spaced and adjacent electrically conductive elongated lines, the lines comprising ends;
• and
• the pair of conductive lines being encapsulated with an electrically insulative material, the insulating material comprising silicon oxide, a top sealed elongated void provided relative to the electrically insulative material between the lines facilitating electrical isolation of the lines from one another, the void having an end, a portion of the insulating material being at the end of the void, the portion of the insulating material at the end of the void not having a retrograde profile relative to the ends of the lines.

Integrated circuitry comprising:

• a pair of elongated lines over a substrate, the lines comprising ends;
• and
• an overlying material provided over the pair of lines, a top sealed elongated void provided under the overlying material and between the lines, the void having an end, a portion of the overlying material being at the end of the void, the portion of the overlying material at the end of the void comprising a surface which extends substantially perpendicularly to the substrate.

Integrated circuitry comprising:

• a pair of spaced and adjacent electrically conductive elongated lines over a substrate, the lines comprising ends;
• and
• the pair of conductive lines being encapsulated with an electrically insulative material, the insulating material comprising silicon oxide, a top sealed elongated void provided relative to the electrically insulative material between the lines facilitating electrical isolation of the lines from one another, the void having an end, a portion of the insulating material being at the end of the void, the portion of the insulating material at the end of the void comprising a surface which extends substantially perpendicularly to the substrate.