Electronic circuit prototype wiring board with visually distinctive contact pads

Abstract

Electronic circuit prototype wiring board is fabricated with layers of electrically conductive material separated by layers of dielectric material. Contact pads of electrically conductive material are arrayed on a surface of the board. Columns of electrically conductive material extend upward from each of the conductive layers to selected contact pads, passing through perforations in any intermediate layers above, such that each of the pads is in electrical communication with only one of the conductive layers. All of the pads connected to a common conductive layer are of a similar geometric plan form which is associated with that layer and which is different and distinguishable from the plan form of pads in electrical communication with any other of the conductive layers. In an alternative embodiment, the wiring board is fabricated of an elastic dielectric material. Access points for each conductive layer of the board are identified by similar geometric shapes associated with that layer and which are different and distinguishable from shapes identifying access points for any other of the conductive layers. Pins fabricated of electrically conductive material are inserted into the elastic dielectric material to establish electrical contact with a desired conductive layer and be retained by the dielectric material to serve as a wiring post.

Dependencies are inferred from the claim text.