Resins for use in chemically amplified resists and manufacturing methods thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-jun Choi, Chun-geun Park
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Abstract
Resins for use in chemically amplified resists are represented by the general formula (I): ##STR1## wherein R.sub.1 is t-butyl or tetrahydropyranyl; R.sub.2 is hydrogen or methyl; n and m are integers; and the ratio n/((m+n) ranges from 0.1 to 0.9. Methods for manufacturing the resins comprise reacting a monomer represented by the formula (II): ##STR2## with a monomer represented by the formula (III): ##STR3## to form a copolymer represented by the formula (IV): ##STR4## wherein R.sub.1 and R.sub.2 are defined as above; and hydrolyzing acetoxy groups contained in the copolymer represented by the formula (IV) to form the resin compositions.
Claims7
A method of manufacturing a resin, being represented by the general formula (I):
- ##STR21## wherein R.sub.1 is selected from the group consisting of t-butyl and tetrahydropyranyl;
- R.sub.2 is selected from the group consisting of hydrogen and methyl;
- n and m are integers;
- and the ratio of n/(m+n) ranges from 0.1 to 0.9, said method comprising:
- reacting a monomer represented by the formula (II):
- ##STR22## with a monomer represented by the formula (III):
- ##STR23## to form a copolymer represented by the formula (IV):
- ##STR24## wherein the mole ratio of the monomer of formula (II) to the monomer of formula (III) ranges from 0.1:0.9 to 0.9:0.1;
- dissolving the copolymer of formula (IV) in a solvent;
- and
- adding hydrazine to the dissolved copolymer to form the resin represented by the formula (I).
Dependencies are inferred from the claim text.