Process for flame-proofing organic polymeric materials
AssigneeCiba Specialty Chemical Corporation
InventorsMichael Bauer, Manfred Rembold
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Abstract
A process is described for flame-proofing organic polymeric materials by means of a low temperature plasma treatment in the presence of at least one volatile, low-molecular compound. The process comprises subjecting a volatile compound, selected from a halogen-free phosphorus compound, to the low temperature plasma, such that a homogeneous polymeric structure forms on the organic material. A very wide range of organic materials can be effectively flame-proofed with the process of this invention without adversely affecting their other properties such as mechanical properties or photochemical stability.
Claims16
A process for flame-proofing an organic polymeric substrate which comprises:
- A) subjecting at least one volatile, low molecular halogen-free phosphorous compound which is an unsaturated organophosphorous acid or derivative thereof, a substituted phosphazene compound or a phosphorus compound of the formula ##STR6## wherein X.sub.1 and X.sub.2 are each independently of the other a radical of the formula
- --A.sub.2 R.sub.1, (2)
- A.sub.1 and A.sub.2 are each independently of the other oxygen or sulfur;
- R.sub.1 is hydrogen;
- C.sub.1 -C.sub.5 alkyl, C.sub.1 -C.sub.5 alkoxy, C.sub.2 -C.sub.5 alkenyl, each unsubstituted or substituted by hydroxy or cyano;
- mono- or di-C.sub.1 -C.sub.5 alkylamino;
- or C.sub.2 -C.sub.5 alkenyloxy;
- X.sub.3 is C.sub.1 -C.sub.5 alkyl, C.sub.2 -C.sub.5 alkenyl or C.sub.2 -C.sub.5 alkynyl, each unsubstituted or substituted by hydroxy, C.sub.1 -C.sub.5 alkoxy, C.sub.2 -C.sub.5 alkylcarbonyl, C.sub.2 -C.sub.5 alkoxycarbonyl, cyano, C.sub.1 -C.sub.5 alkylthio or phenyl;
- C.sub.3 -C.sub.5 alkyldienyl;
- C.sub.1 -C.sub.5 alkoxy which is unsubstituted or substituted by C.sub.1 -C.sub.5 alkyl, C.sub.2 -C.sub.5 alkenyl;
- C.sub.2 -C.sub.5 alkenyloxy;
- C.sub.2 -C.sub.5 alkoxycarbonyl;
- mono- or di-C.sub.1 -C.sub.6 alkylamino;
- mono- or di-C.sub.2 -C.sub.5 alkenylamino;
- mono- or di-C.sub.1 -C.sub.6 alkylamino;
- phenyl which is unsubstituted or substituted by hydroxy, C.sub.1 -C.sub.5 alkoxy, C.sub.2 -C.sub.5 alkylcarbonyl, C.sub.2 -C.sub.5 alkoxycarbonyl, C.sub.1 -C.sub.5 alkylthio or phenyl;
- or a radical of formula ##STR7## to a low temperature plasma treatment;
- and B) forming a polymeric structure on the surface of the organic polymeric substrate by contacting the plasma-subjected halogen-free phosphorus compound of A with the organic polymeric substrate.
Dependencies are inferred from the claim text.