Materials for semiconductor device assemblies
AssigneeJohnson Matthey PLC
InventorsMichael M. Chau, Donald A. Burkhart
Life of this patent
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Abstract
A composition suitable for use as an underfill for an interconnection between a semiconductor device and a substrate, as a semiconductor device encapsulant, a dam, an adhesive for direct chip attachment, and as an electrical connection for semiconductor device and a substrate. The composition contains about 40 to 90 wt. % of an electrically conductive or non-conductive filler and a cyanate ester and epoxy resin component. The cyanate ester/epoxy resin component comprises about 10 to 70 wt. % cyanate ester material, about 30 to 90 wt. % of epoxy resin, about 0.1 to 1.5 wt. % metal chelate/amine solid curing catalyst and about 0.1 to 5 wt. % of a coupling agent.
Claims14
A composition suitable for use in a semiconductor device assembly comprising a cyanate ester and epoxy resin component and about 40 to 90 wt. % filler, said cyanate ester and epoxy resin component comprising about 10 to 70 wt. % cyanate ester material, about 30 to 90 wt. % epoxy resin, about 0.1 to 1.5 wt. % curing catalyst and about 0.1 to 5 wt. % coupling agent, wherein the epoxy resin is selected from the group consisting of bisphenol A-based epoxy resins, bisphenol E-based epoxy resins, bisphenol F-based epoxy resins, epoxy novalac and biphenyl epoxy, and wherein said composition is in the form of a paste at room temperature.
Dependencies are inferred from the claim text.