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AssigneeNorthrop Grumman Corporation
InventorsAlex Bailey, Ronnie Starling, John Chino, Tapan Gupta
Estimating the term…
A cavity pattern for a laminated structure such as a substrate for integrated circuitry is formed in a sheet of unfired low temperature cofired ceramic (LTCC) material also known as "green" tape. One sheet at a time is placed in a flexible ram forming die including a resilient rubber pressure pad and a template including the pattern to be formed in the sheet. A pair of outer pressure plates hold the pressure pad and template in place. When a sheet of unfired LTCC material is placed between the pressure pad and template and pressurization is applied to the outer plates, extrusion of the rubber material through the template causes the tape to be sheared off at the edges of the holes in the template, thus effectively cutting the required pattern in the sheet. Following pressurization, the sheet now with the pattern cut therein is removed from the die and the residual tape cut-outs are subsequently removed from the template by a vacuum.
A method of forming one or more openings in a sheet of low temperature cofired ceramic (LTCC) material which corresponds to a cavity pattern produced when a plurality of said sheets are subsequently laminated together, comprising the step of:
Dependencies are inferred from the claim text.