Rinse water recycling method for semiconductor wafer processing equipment
AssigneeIntegrated Process Equipment Corp.
InventorsJohn A. Adams, Gerald A. Krulik
Life of this patent
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Abstract
Waste water from an apparatus that rinses particles from semiconductor wafers is collected in a tank. A pump sends waste water from the tank through a particle filter and onward to a supply inlet for initial rinse stages of the processing apparatus. Some of the waste water is bleed from the tank and replenished by fresh water introduced into the final rinse stage of the apparatus. If the semiconductor processing so dictates, chemicals may be added to the waste water to alter the pH and/or prevent the precipitation of solids in the tank. The addition of such chemicals can be controlled automatically in response to sensed characteristics of the waste water.
Claims20
A method for recycling water used to rinse particles from semiconductor wafers in a processing apparatus, said method comprising the steps of receiving waste water from an outlet of the processing apparatus;
- removing particles from waste water to produce less than ultra pure, deionized water;
- and supplying the less than ultra pure, deionized water to an inlet of the processing apparatus to rinse particles from a wafer, then supplying ultra pure, deionized water to said processing apparatus to rinse particles from said wafer, wherein said less than ultra pure, deionzed water is free of sufficient particles so as not to leave a solid residue on said wafer.
A method for recycling water used to rinse particles from semiconductor wafers in a processing apparatus which has a drain outlet and an inlet, said method comprising step of:
- receiving water from the drain outlet in a vessel;
- pumping water from the vessel;
- removing particles from the water pumped from the vessel to produce less than ultra pure, deionized water for supply to said processing apparatus;
- draining off a portion of the waste water received from the drain outlet;
- and
- adding fresh water to rinse particles from a wafer after said less than ultra pure, deionized water is supplied to said processing apparatus to rinse particles from said wafer, a flow of water between the drain outlet and the inlet of the processing apparatus, wherein said less than ultra pure, deionized water is free of sufficient particles so as not to leave a solid residue on said wafer.
A method for recycling water used to rinse particles from semiconductor wafers in a processing apparatus having an initial rinse stage which receives water from a first inlet, a final rinse stage which receives water from a second inlet, and a drain outlet;
- said method comprising steps of:
- pumping water received from the drain outlet;
- removing particles from the water pumped from the drain outlet to produce filtered, ionized water;
- supplying the filtered, ionized water to the first inlet of the apparatus to rinse particles from a wafer
- draining off a portion of the waste water received from the drain outlet;
- and
- adding fresh, deionized water to the second inlet of the processing apparatus to rinse particles from said wafer, wherein said filtered, ionized water is free of sufficient particles so as not to leave a solid residue on said wafer.
Dependencies are inferred from the claim text.