Outer lead bonding apparatus and method of bonding lead to substrate

An outer lead bonding apparatus for bonding a plurality of leads extending outwardly of a semiconductor chip to bonding pads mounted on a substrate, said apparatus comprising:

• a bonding-aid member including:
• a horizontally extending central planar portion to adhere the semiconductor chip to,
• a vertically extending sidewall,
• a flange portion extending outward horizontally from a lowermost end of said sidewall, said flange portion to be adhered to said substrate,
• a support portion for connecting said central portion to said sidewall, and an opening between said central portion and said sidewall,
• means for exposing distal ends of said leads at which said lead are to be bonded to said bonding pads when the semiconductor chip is adhered to the horizontally extending central planar portion and the flange portion contacts the substrate, said means comprising an opening between said central portion and said sidewall defined by said support portion, the distal ends being the portion of said leads to be bonded to said bonding pads;
• means for detecting whether said exposed distal ends of said leads align with said bonding pads;
• and
• a bonding tool having a wall for compressing said leads to said bonding pads, based on a detection by said means for detecting, to bond them with each other, said wall having a cross-section able to pass through said opening of said bonding-aid member.

An outer lead bonding apparatus for bonding a plurality of leads extending outwardly of a semiconductor chip to bonding pads mounted on a substrate, said apparatus comprising:

• a bonding-aid member composed of magnetic material and including:
• a chip support area for the semiconductor chip to be adhered to, said chip support area comprising a lower surface of a central portion of said bonding-aid member,
• a marginal portion for contacting said substrate, and
• means for exposing distal ends of said leads when the semiconductor chip is adhered to said chip support area and said marginal portion is in contact with the substrate, the distal ends being the portion of said leads to be bonded to said bonding pads, said means comprising an opening in said bonding-aid member
• between said central position and said marginal portion;
• means for detecting whether said exposed distal ends of said leads align with said bonding pads;
• a magnet disposed around said substrate, said marginal portion of said bonding-aid member to be attracted to said magnet;
• and
• a bonding tool having compressing portions for compressing said leads to said bonding pads based on a detection by said means for detecting, said compressing portions having a cross-section able to pass through said opening of said bonding member.

An outer lead bonding apparatus for bonding a plurality of leads extending outwardly of a semiconductor chip to bonding pads mounted on a substrate, said substrate being formed with a recess, said bonding pads being disposed on a bottom surface of said recess, said recess having a depth equal to a total height of said semiconductor chip and said bonding pad, said apparatus comprising:

• a bonding-aid member comprising a flat plate, said bonding-aid member including:
• a chip support area for the semiconductor chip to be adhered to, said chip support area comprising a lower surface of a central portion of said bonding aid member,
• a marginal portion for contacting said substrate,
• a support portion for connecting said central portion to said marginal portion, and
• means for exposing distal ends of the leads when the semiconductor chip is adhered to said chip support area and said marginal portion is in contact with the substrate, said means comprising an opening defined by said support portion between said central portion and said marginal portion, the distal ends being the portion of said leads to be bonded to said bonding pads,
• means for detecting whether said exposed distal ends of said leads are aligned with said bonding pads;
• and
• a bonding tool having a wall for compressing said leads to said bonding pads to bond them with each other based on a detection by said means for detecting, said wall having a cross-section able to pass through said opening of said bonding-aid member.

A bonding-aid member to be used with an outer lead bonding apparatus which bonds a plurality of leads extending outwardly of a semiconductor chip to bonding pads mounted on a substrate, said bonding-aid member comprising:

• a chip support area for the semiconductor chip to be adhered to, said chip support area comprising a lower surface of a central portion of said bonding aid member;
• a marginal portion to be adhered to the substrate, said marginal portion surrounding said central portion;
• and
• means for exposing distal ends of said leads when the semiconductor chip is adhered to said chip support area and said marginal portion is in contact with the substrate, the distal ends being the portion of said leads to be bonded to said bonding pads, said means comprising an opening in said bonding-aid member between said central position and said marginal portion.

A bonding-aid member to be used with an outer lead bonding apparatus which bonds a plurality of leads extending outwardly of a semiconductor chip to bonding pads mounted on a substrate, said bonding-aid member comprising:

• a horizontally extending central planar portion to adhere the semiconductor chip to:
• a vertically extending sidewall;
• a flange portion extending outward horizontally from a lowermost end of said sidewall, said flange portion to be adhered to said substrate;
• a support portion for connecting said central portion to said sidewall;
• and
• means for exposing distal ends of said leads when the semiconductor chip is adhered to the horizontally extending central planar portion and the flange portion contacts the substrate, said means comprising an opening between said central portion and said sidewall defined by said support portion, the distal ends being the portion of said leads to be bonded to said bonding pads.

A bonding-aid member to be used with an outer lead bonding apparatus which bonds a plurality of leads extending outwardly of a semiconductor chip to bonding pads mounted on a substrate, said substrate being formed with a recess, said bonding pads being disposed on a bottom surface of said recess, said recess having a depth equal to a total height of said semiconductor chip and said bonding pads, said bonding-aid member comprising a flat plate, which includes:

• a chip support area for the semiconductor chip to be adhered to, said chip support area comprising a lower surface of a central portion of said bonding aid member,
• a marginal portion for contacting said substrate,
• a support portion for connecting said central portion to said marginal portion, and
• means for exposing distal ends of the leads when the semiconductor chip is adhered to said chip support area and said marginal portion is in contact with the substrate, said means comprising an opening formed by said support portion between said central portion and said marginal portion, the distal ends being the portion of said leads to be bonded to said bonding pads.