US 5,855,711 AGranted

Method of producing a ceramic circuit substrate

AssigneeSumitomo Metal (SMI) Electronics Devices Inc.

InventorsHideaki Araki, Masashi Fukaya

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Abstract

A ceramic circuit substrate providing a circuit pattern with a fine line as well as high accuracy for positioning the circuit pattern and a method of producing the ceramic circuit substrate. An alumina layer that is green containing an alumina that is not sintered at a temperature ranging from 800.degree. to 1000.degree. C. is applied on a surface of a ceramic green sheet containing glass and then fired at a temperature ranging from 800.degree. to 1000.degree. C. The ceramic green sheet is sintered into a sintered ceramic substrate. A porous alumina layer is formed on a surface of the sintered ceramic substrate. The glass contained in the sintered ceramic substrate is caused to flow to the inside of the porous alumina layer so that the part of the porous alumina layer filled with the glass is bonded to the sintered ceramic substrate. The part of the porous alumina layer not filled with the glass is removed, wherein the porous alumina layer remaining on the sintered ceramic substrate after the removing has a thickness of 10 .mu.m or less. A paste for forming the circuit pattern is printed on a surface of the part of the porous alumina layer that has been bonded to the sintered ceramic substrate for heating.

Claims4

Dependent claims

A method of producing a ceramic circuit substrate comprising:

preparing a laminated body by applying an alumina layer that is green containing an alumina that is not sintered at a temperature ranging from 800.degree. to 1000.degree. C. to a surface of a ceramic green sheet containing glass that is sintered at a temperature ranging from 800.degree. to 1000.degree. C.;
forming a sintered ceramic substrate by sintering said ceramic green sheet and forming said alumina layer into a porous alumina layer through firing said laminated body at a temperature ranging from 800.degree. to 1000.degree. C.;
and causing said glass to flow into said porous alumina layer so as to bond a part of said porous alumina layer filled with said glass to said sintered ceramic substrate;
removing an alumina part of said porous alumina layer that has not been bonded to a surface of said sintered ceramic substrate;
printing a paste for forming a circuit pattern on a surface of said porous alumina layer;
and
adhering said circuit pattern to said sintered ceramic substrate with the aid of said porous alumina layer by firing said sintered ceramic substrate;
wherein said porous alumina layer remaining on said sintered ceramic substrate after the removing of said alumina part has a thickness of 10 .mu.m or less.

5 more elements

Dependencies are inferred from the claim text.