Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same

Abstract

A unit printed circuit board (PCB) carrier frame used in the fabrication of a heat sink-attached ball grid array (BGA) semiconductor packages and a method for BGA semiconductor packages using the unit PCB carrier frame. The unit PCB carrier frame has a plurality of die pads each defined at its peripheral edges by elongated slots formed at a strip or reel-shaped frame member. For the fabrication of heat sink-attached BGA semiconductor packages, unit PCBs are bonded to the die pads of the unit PCB carrier frame. Accordingly, the bending of the packages is minimized even when they pass through subsequent processes requiring a high temperature. As a result, it is possible to obtain a maximum number of unit PCBs from a PCB panel, thereby achieving an improvement in productivity.

Dependencies are inferred from the claim text.