Electronic circuit board with semiconductor chip mounted thereon, and manufacturing method therefor

A circuit board, comprising:

• a plurality of semiconductor chips having bonding pads formed on a surface thereof for connecting internal electronic circuits of the semiconductor chips to external circuits;
• a circuit board having an upper surface, a lower surface, a plurality of terminals, and a plurality of openings, wherein the upper surface of the circuit board comprises a plurality of bonding pads formed around the openings, wherein the bonding pads are electrically coupled to the terminals, wherein each of the semiconductor chips is attached to the lower surface of the circuit board over one of the openings with a chip attaching means;
• a plurality of wires coupling the bonding pads on the semiconductor chip to respective bonding pads on the circuit board;
• and
• one or more protective covers covering the semiconductor chips and the wires, wherein at least one of the protective covers extends over more than one of the semiconductor chips.