Test board for testing a semiconductor device and method of testing the semiconductor device
AssigneeFujitsu Limited
InventorsToshiyuki Motooka, Syuichirou Takahashi, Tatsuharu Matsuda, Kunio Kodama, Jouji Fujimori
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Abstract
A test board used for testing a semiconductor device provided with projection electrodes includes a main board and testing electrodes. The testing electrodes are provided on the main board, each projecting upwardly from the main board. When the semiconductor device is tested, the testing electrodes are electrically connected to the projection electrodes by insertion of the testing electrodes into the projection electrodes. The semiconductor device is mounted on the main board to test the semiconductor device through the testing electrodes.
Claims10
A test board for testing a semiconductor device provided with projection electrodes, said test board comprising:
- a main board;
- and
- testing electrodes provided on said main board, each projecting upward from the main board;
- wherein said testing electrodes are formed as a cylindrically-shaped wire bump and are electrically connected to said projection electrodes by insertion of said testing electrodes into the projection electrodes and the semiconductor device is mounted on the main board to test the semiconductor device through the testing electrodes, and wherein each of said testing electrodes has a diameter less than a diameter of each of said projection electrodes.
A method of testing a semiconductor device on which projection electrodes are formed, said method using a test board having a main board and testing electrodes formed on the main board and formed as a cylindrically-shaped wire bump comprising palladium, each of said testing electrodes projecting upwardly from the main board and each of said testing electrodes having a diameter less than a diameter of each of said projection electrodes, said method comprising the steps of:
- (a) mounting said semiconductor device on the main board of the test board by inserting said testing electrodes into the projection electrodes, wherein said testing electrodes are electrically connected to the projection electrodes;
- (b) testing said semiconductor device by using said testing electrodes connected to the projection electrodes;
- and
- (c) separating said semiconductor device from the test board.
Dependencies are inferred from the claim text.