High density leaded ball-grid array package

A high density leaded ball-grid array package for packaging an integrated-circuit die comprising:

• a non-conductive layer having top and bottom sides;
• a first conductive trace pattern being laminated on the top side of said non-conductive layer;
• a second conductive trace pattern being laminated on the bottom side of said non-conductive layer, said non-conductive layer being sandwiched between said first and second conductive trace patterns so as to form a laminated substrate;
• a high lead-count leadframe having a plurality of conductive leads and a centrally-located open portion, said plurality of conductive leads having innermost ends defining bonding fingers;
• said leadframe being directly attached onto said first conductive trace pattern of the laminated substrate by a non-conductive adhesive so that the open portion thereof overlies a central region of said laminated substrate;
• a solder mask being disposed over said second conductive trace pattern so as to form selective solderable areas;
• and
• an integrated-circuit die being mounted in the central region of said laminated substrate, said bonding fingers being disposed peripherally surrounding said integrated-circuit die;
• bonding wires interconnected between bonding pads formed on said integrated-circuit die and said bonding fingers on said leadframe;
• a plastic material being molded over the top of said die, bonding fingers and bonding wires;
• solder balls being attached to said selective solderable areas.