US 5,854,508 A · Semiconductor memory device having zigzag bonding pad arrangement

Semiconductor memory device having zigzag bonding pad arrangement

AssigneesHitachi, Ltd., Hitachi VLSI Engineering Corp.

InventorsKazuhiko Kajigaya, Kazuyuki Miyazawa, Manabu Tsunozaki, Kazuyoshi Oshima, Takashi Yamazaki, Yuji Sakai, Jiro Sawada, Yasunori Yamaguchi, Tetsurou Matsumoto, Shinji Udo, Hiroshi Yoshioka, Hirokazu Saito, Mitsuhiro Takano, Makoto Morino, Sinichi Miyatake, Eiji Miyamoto, Yasuhiro Kasama, Akira Endo, Ryoichi Hori, Jun Etoh, Masashi Horiguchi, Shinichi Ikenaga, Atsushi Kumata

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Abstract

Herein disclosed is a semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. Thanks to this structure in which the peripheral circuits are arranged at the center portion of the chip, the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.

Claims14

Dependent claims

A semiconductor device comprising:

a rectangular shaped semiconductor chip having bonding pads formed on a main surface thereof, said bonding pads being arranged in a direction substantially parallel to longer edges of said rectangular shaped semiconductor chip and in a zigzag formation;
leads being arranged on said main surface of said rectangular shaped semiconductor chip;
and
wires electrically connecting said bonding pads with said leads.

1 more element

A semiconductor device comprising:

a rectangular shaped semiconductor chip having first bonding pads and second bonding pads formed on a main surface thereof, each of said first and second bonding pads being arranged in a direction substantially parallel to longer edges of said rectangular shaped semiconductor chip, said first bonding pads being arranged on a first imaginary line at a predetermined interval, said second bonding pads being arranged on a second imaginary line at the predetermined interval, each of said first and second imaginary lines extending in the direction substantially parallel to said longer edges of said rectangular shaped semiconductor chip, said second bonding pads being arranged at intersecting positions of said second imaginary line and third imaginary lines, each of said third imaginary lines being arranged at a substantially central position of adjacent ones in said first bonding pads and extending in a direction substantially perpendicular to said first and second imaginary lines, each of said first to third imaginary lines being imaginarily formed on said main surface of said rectangular shaped semiconductor chip;
leads being arranged on said main surface of said rectangular shaped semiconductor chip;
and
wires electrically connecting said first and second bonding pads with said leads.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

08/618,381Filed 19 Mar 1996 · continuation

Priority

JP 63-2771321 Nov 1988

Granted

29 Dec 1998

Term ends

Not estimatedThe source records don’t support an estimate.

Classification18 codes

G11C 5/025
Disposition of storage elements, e.g. in the form of a matrix array: geometric lay-out considerations of storage- and peripheral-blocks in a…
G11C 11/406
Forming cells needing refreshing or charge regeneration, i.e. dynamic cells: management or control of the refreshing or charge-regeneration cycles
H10W 72/90
Interconnections or connectors in packages: bond pads, in general
H10W 72/536
Shapes of wire connectors: the connected ends being ball-shaped

Family

Serial424,904Parent of this continuation · filed 18 Oct 1989

Serial899,572Parent of this division · filed 18 Jun 1992

Serial159,621Parent of this continuation · filed 1 Dec 1993

Serial455,411Parent of this continuation · filed 31 May 1995

US 5,544,096 AParent of this continuation

5548547Parent of this continuation

US 5,854,508 AThis patent

From the US filing history. Foreign family members aren’t listed.