Phosphorus-modified epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a curing agent
AssigneeHoechst Aktiengesellschaft
InventorSebastian Horold
Life of this patent
Estimating the term…
Abstract
The invention relates to a flame-resistant epoxy resin mixture comprising epoxy resins, phosphorus-containing compounds and a curing agent, wherein the epoxy resin mixture comprises phosphorus-containing structural units of the formula I ##STR1## in which R1 is an alkyl or aryl group having from 1 to 10 carbon atoms, R2 is hydrogen or an alkyl group having from 1 to 4 carbon atoms and R is an alkylene, cycloalkylene or arylene group having from 2 to 20 carbon atoms.
Claims3
A method of using an epoxy resin mixture comprising incorporating said mixture into a coating and applying said coating to electrical or electronic components, wherein said mixture comprises epoxy resin, phosphorous-containing compounds and a curing agent, and wherein said epoxy resin mixture comprises structural units of the formula (I) ##STR7## in which R1 is an alkyl or aryl group having from 1 to 10 carbon atoms, R2 is hydrogen or an alkyl group having from 1 to 4 carbon atoms and R is an alkylene, cycloalkylene or arylene group having from 2 to 20 carbon atoms.
A prepreg or a composite material based on inorganic or organic reinforcing materials in the form of fibers, webs or fabrics and produced from an epoxy resin mixture wherein said mixture comprises epoxy resin, phosphorous-containing compounds and a curing agent, wherein said epoxy resin mixture comprises structural units of the formula (I) ##STR8## in which R1 is an alkyl or aryl group having from 1 to 10 carbon atoms, R2 is hydrogen or an alkyl group having from 1 to 4 carbon atoms and R is an alkylene, cycloalkylene or arylene group having from 2 to 20 carbon atoms.
A printed circuit board made from a prepreg produced from glass-fiber fabrics and an epoxy resin mixture wherein said mixture comprises epoxy resin, phosphorous-containing compounds and a curing agent, wherein said epoxy resin mixture comprises structural units of the formula (I) ##STR9## in which R1 is an alkyl or aryl group having from 1 to 10 carbon atoms, R2 is hydrogen or an alkyl group having from 1 to 4 carbon atoms and R is an alkylene, cycloalkylene or arylene group having from 2 to 20 carbon atoms.
Dependencies are inferred from the claim text.