Photosensitive adhesive composition for additive plating

Abstract

The present invention provides a photosensitive adhesive composition for additive plating, comprising the following components (a), (b), (c), (d), (e) and (f) as essential components; and an excellent multilayer printed circuit board obtained by using the adhesive composition: (a) a polyfunctional epoxy resin having an epoxy equivalent of 120-500, (b) a modified phenol novolac obtained by reacting 20-60 mole % of the phenolic hydroxyl groups of a phenol novolac obtained by condensing a phenol compound with formaldehyde in the presence of an acidic catalyst, with a glycidyl group-containing acrylate or methacrylate, (c) an epoxy acrylate or epoxy methacrylate compound, (d) a diluent consisting of a polyfunctional monomer having a plurality of photosensitive functional groups or a polyfunctional monomer having a photosensitive functional group and a heat-sensitive functional group, or a diluent consisting of a combination of the two monomers, (e) a photopolymerization initiator, and (f) an acid-soluble filler.

Dependencies are inferred from the claim text.