US 5,854,085 AGranted

Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same

AssigneeLSI Logic Corporation

InventorsKurt Raymond Raab, John McCormick

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Abstract

Separate and distinct conductive layers for power and ground are insulated from one another and a patterned signal conductive layer to form a flexible substrate for mounting a semiconductor die in a semiconductor device assembly. TAB technology is utilized to produce an assembly that has superior electrical characteristics because power and ground is conducted on separate low impedance conductive layers. The power and ground leads connecting the semiconductor die and external circuits are selected from the signal trace layer, cut bent downward and attached by bonding to the respective power or ground layer. A tool is disclosed for cutting the selected leads. A method of attaching solder balls to a TBGA film using solder flux and photoimageable solder resist definition is also disclosed.

Claims12

Dependent claims

A method for attaching collapsible solder balls to a tape ball grid array (TBGA) using solder flux and photoimageable solder resist definition, comprising the steps of:

creating tape automated bonding (TAB) tape solder ball pads in a conductive layer;
applying photoimageable solder resist over the solder ball pads;
developing the applied photoimageable solder resist to create openings in the resist over the underlying pads, thereby exposing only a desired surface in the patterned resist openings;
plating the exposed surfaces of the solder ball pads;
applying solder flux to the plated exposed surfaces of the solder ball pads;
placing solder balls onto the plated exposed surface, wherein the solder flux holds the solder balls in place;
heating the solder balls so as to electro-mechanically connect them to the plated exposed surfaces of the solder pads;
and
removing any remaining solder flux.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/638,898Filed 24 Apr 1996 · division
Priority: 4 Jun 1992
Granted: 29 Dec 1998
Term ends: Not estimatedThe source records don’t support an estimate.

Classification23 codes

H10W 90/00
Package configurations
G01R 1/07342
With individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or…:…
H10P 74/273
Structural arrangements therefor: interconnections for measuring or testing, e.g. probe pads
H10W 40/22
Arrangements for cooling: characterised by their shape, e.g. having conical or cylindrical projections