Method for producing a micro optical semiconductor lens

A method for producing a III-V semiconductor micro-optical lens for hybrid integration to a micro-optical device, said method comprising the steps of:

• selectively boring a surface of a side of a substrate wafer to form a lens;
• cleaning the surface of the side of the substrate wafer;
• selectively etching the entire surface of the side of the substrate wafer where the lens is formed to polish the lens;
• coating the entire surface of the side of the substrate wafer with an antireflectivity coating;
• and
• fabricating a lens arm from a surface of a side of the substrate wafer opposite the side of the substrate wafer where the lens has been formed.

A method for producing a III-V semiconductor micro-optical lens arm for hybrid integration to a micro-optical device, said method comprising the steps of:

• coating a layer of photoresist material over an entire surface of a side of a substrate wafer opposite a side of the substrate wafer where a lens has been formed;
• baking the substrate wafer to prepare the photoresist material;
• providing a mask where a pattern of the mask determines the quantity and size of a lens arm formed on the substrate wafer;
• selectively aligning the mask to the substrate wafer on the side of the substrate wafer coated with the layer of photoresist material;
• exposing the side of the substrate wafer coated with the layer of photoresist material to a light source to form a photoresist mask;
• developing the side of the substrate wafer coated with the photoresist material;
• etching the side of the substrate wafer coated with the layer of photoresist material in the areas surrounding the photoresist mask to form a lens arm and a trough area surrounding the lens arm;
• removing the photoresist mask and cleaning the surface of the substrate wafer;
• metallizing the lens arm;
• cleaving the lens arm and lens to remove the lens arm and lens from the substrate wafer;
• and
• mounting the lens to the micro-optical device.