Composite article resistant to moisture-induced debonding
AssigneeH. B. Fuller Licensing & Financing, Inc.
InventorWilliam L. Bunnelle
Life of this patent
Estimating the term…
Abstract
The articles of this invention have increased resistance to moisture induced delamination at a bond line comprising a substrate, a second layer an dan adhesive. The increased resistance to moisture and increase in bond strength between the adhesive, the substrate and the second layer is produced through a novel adhesive. The adhesive after spraying cools to below the softening point of the components but retains sufficient liquidity to fully wet or to penetrate the second layer causing the layers to be bonded to the film substrate through intimate adhesive bonds or by bonding through a physical entrapment. The physical entrapment of the nonwoven layer substantially prevents moisture-induced debonding or delamination.
Claims14
An article resistant to moisture-induced debonding comprising a substrate joined with a second layer by a sprayed-on adhesive, said adhesive comprising:
- (a) about 10-40 parts by weight of a thermoplastic block copolymer selected from the group consisting of an A-B-A block copolymer, an A-(B-A).sub.n -B-A block copolymer, wherein n is an integer of about 1 or more, and a radial block copolymer, each A comprising a polystyrene block and each B comprising a rubbery block;
- (b) about 30 to 75 parts by weight of a tackifying resin selected from the group consisting of a rosin derived tackifying resin, an aliphatic tackifying resin, a mixed aromatic-aliphatic tackifying resin, and mixtures thereof;
- and
- (c) about 5 to 40 part by weight of a cyclohexane dimethanol dibenzoate plasticizer compound;
- and wherein, after the adhesive is sprayed on and cooled to ambient temperature, the adhesive retains sufficient liquidity for a sufficient time to wet or to penetrate the substrate or the second layer to form a moisture-resistant bond.
Dependencies are inferred from the claim text.