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US 5,853,803 AGranted
Resist processing method and apparatus
AssigneesTokyo Electron Limited, Tokyo Electron Kyushu Limited
InventorsKiyohisa Tateyama, Kimio Motoda, Tatsuya Iwasaki, Takenobu Matsuo, Kazuki Denpoh, Eiji Yamaguchi
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Abstract
A method of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.
Claims7
A method of resist-processing a rectangular substrate comprising, the steps of;
- a resist coating step of supplying resist solution to the substrate, while spin-rotating the substrate, to form resist film at least on one surface of the substrate;
- and
- a resist removing step of jetting removing liquid, which can dissolve the resist, to peripheral portions of both surfaces of the substrate to remove the resist film from the peripheral portions.
A method of resist-processing a rectangular substrate comprising;
- spin-rotating the substrate while supplying resist solution into a process vessel;
- exhausting the process vessel while introducing an outside air into said process vessel to generate air current flowing above the substrate which is being resist-coated and from the center to the outer rim of the substrate;
- and
- replacing atmosphere in the process vessel by the outside air after the resist coating step is finished.
1 more element
Dependencies are inferred from the claim text.