Molding die set and mold package
AssigneeOki Electric Industry Co., Ltd.
InventorJirou Matsumoto
Life of this patent
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Abstract
A molding die set includes an upper die having an upper cavity; and a lower die including a lower cavity to be arranged to face the upper cavity, and a gate which guides plasticized resin into the lower cavity and the upper cavity. The lower cavity is provided with a projection region which is projecting inwardly. The gate is arranged to be extending in the projection region.
Claims21
A molding die set used for fabricating a mold package, which protects an IC (Integrated Circuit) therein, comprising:
- an upper die which comprises an upper cavity;
- and
- a lower die which comprises a lower cavity arranged to face the upper cavity, and a gate which guides plasticized resin into the lower cavity and the upper cavity, wherein
- the lower cavity is provided with a projection region which is projecting inwardly;
- and the gate is arranged to be extending in the projection region.
A mold package protecting an IC (Initegrated Circuit), which is fabricated using a molding die set, wherein
- the molding die set comprises:
- (1)an upper die which comprises an upper cavity;
- and
- (2)a lower die which comprises a lower cavity arranged to face the upper cavity, and a gate which guides plasticized resin into the lower cavity and the upper cavity, wherein
- the lower cavity is provided with a projection region which is projecting inwardly;
- and the gate is arranged to be extending in the projection region.
A molding system for fabricating a mold package protecting an IC (Integrated Circuit), comprising:
- an upper die which comprises an upper cavity;
- a lower die which comprises a lower cavity arranged to face the upper cavity, and a gate which guides plasticized resin into the lower cavity and the upper cavity;
- and
- a resin supply which supplies the plasticized resin to the gate, wherein
- the lower cavity is provided with a projection region which is projecting inwardly;
- and the gate is arranged to be extending in the projection region.
Dependencies are inferred from the claim text.