Method of fabricating a thin film conductor coil assembly

A method of fabricating a thin film conductor coil assembly comprising:

• electroplating and patterning a first thin film coil layer on a substantially planar surface of an electrically nonconducting ceramic substrate;
• forming a first thin film isolating layer overlying the first thin film coil layer and the ceramic substrate;
• forming a thin film magnetic core layer overlying the first thin film isolating layer and the first thin film coil layer;
• forming a second thin film isolating layer overlying the thin film magnetic coil layer;
• and
• electroplating and patterning a second thin film coil layer overlying the second thin film isolating layer and the thin film magnetic core layer, the second thin film coil layer coupling to the first thin film coil layer.

A method of fabricating a thin film conductor coil assembly comprising:

• forming a first conductive metal via and a second conductive metal via in an electrically nonconducting ceramic substrate;
• electroplating and wet etching a thin film coil having opposing first and second thin film coil layers including a first thin film coil layer overlying a surface of the ceramic substrate and a second thin film coil layer, the first and second thin film coil layers having a lead line coupled to respective ones of the first and second metal vias and a plurality of coil lines that are mutually-isolated within a thin film coil layer, but having two ends that are coupled to ends of two coil lines of the opposing thin film coil layer so that the first and second coil layers form a serial path from the first metal via to the second metal via;
• electroplating and wet etching a magnetic core layer between the first and second magnetic coil layers spanning and substantially orthogonal to the coil lines of the first and second magnetic coil layers;
• and
• forming an insulating layer between the first magnetic coil layer and the magnetic core layer and between the magnetic core layer and the second magnetic core layer.

A method of fabricating a thin film conductor coil assembly comprising the steps of:

• forming a first conductive metal via and a second conductive metal via in an electrically nonconducting ceramic substrate;
• electroplating a first coil layer overlying a substantially planar surface of the ceramic substrate;
• wet etching the first coil layer to form a plurality of substantially parallel coil lines and a lead line coupling one of the plurality of coil lines to the first conductive metal via;
• forming a first insulating layer overlying the first coil layer while exposing ends of the parallel coil lines;
• electroplating a magnetic core layer overlying the first insulating layer;
• wet etching the magnetic core layer to form a magnetic core spanning and substantially orthogonal to the parallel coil lines;
• forming a second insulating layer overlying the magnetic core and exposing ends of the parallel coil lines;
• electroplating a second coil layer overlying the second insulating layer;
• and
• wet etching the second coil layer to form a plurality of substantially parallel coil lines and a lead line coupling one of the plurality of coil lines to the second conductive metal via, a first end of the second coil layer coil lines overlying and coupling to a first end of corresponding first coil layer coil lines and the second coil layer coil lines being positioned slightly offset from the first coil layer coil lines so that a second end of the second coil layer coil lines overlies and couples to a second end of coil lines adjacent to the corresponding first coil layer coil lines.