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US 5,853,517 AGranted
Method for coining solder balls on an electrical circuit package
AssigneeW. L. Gore & Associates, Inc.
InventorsWilliam George Petefish, Boydd Piper, Thomas E. Walker
Life of this patent
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Abstract
A method and apparatus are provided for coining solder balls on an organic electrical circuit package. Generally, this method includes placing a slug on one or more of the solder balls; and applying sufficient pressure for a sufficient period of time on the slug to flatten the surface of the solder balls so as to form planar solder coins. The apparatus includes a press; a ram attached to the press; a platform for receiving the package and a slug placed upon the solder balls.
Claims8
A method for coining solder balls of an organic chip package, said method comprising the steps of:
- a) providing a chip package having a plurality of solder balls on a first surface thereof;
- b) placing a slug on one or more of the solder balls;
- and
- c) applying sufficient pressure for a sufficient period of time to the slug to flatten the surface of the solder balls so as to form planar solder coins, wherein said planar solder coins have an average flatness on a surface thereof of less than about 21 microns across about 12 millimeters.
1 more element
Dependencies are inferred from the claim text.