Polishing pad and polishing apparatus having the same
AssigneeNEC Corporation
InventorYoshiaki Yamamoto
Life of this patent
Estimating the term…
Abstract
A polishing pad made of a flexible material includes a first major surface, a second major surface, and a large number of holes. The first major surface is urged by a rotatable polishing target member to polish a polishing target surface of the urged polishing target member by using a slurry. The second major surface is adhered to a rotatable platen. The large number of holes extend between the first and second major surfaces and serve as slurry reservoirs. The holes have a larger opening area on the second major surface than that on the first major surface. A polishing apparatus is also disclosed.
Claims8
A polishing pad made of a flexible material, said polishing pad comprising:
- a first major surface urged by a rotatable polishing target member to polish a polishing target surface of the urged polishing target member by using a slurry;
- a second major surface adhered to a rotatable platen;
- and
- a large number of holes extending between said first and second major surface and serving as slurry reservoirs, a single hole in the first major surface being in registration with a single hole in the second major surface, the holes having a larger opening area on said second major surface than that on said first major surface.
A polishing apparatus comprising:
- a rotatable platen;
- a polishing pad made of a flexible material and adhered on said platen, said polishing pad having a first major surface which is brought into contact with a polishing target member, a second major surface which is disposed toward said polishing pad, and a large number of holes serving as slurry reservoirs;
- a wafer carrier which supports the polishing target member while rotating to urge the polishing target member against said polishing pad which is rotating;
- and
- a slurry supply unit for feeding a slurry to a polishing target surface of the polishing target member during polishing;
- wherein the holes having a larger opening area on said second major surface than that on said first major surface and wherein there is a one to one correspondence between the holes in the first and second major surfaces.
Dependencies are inferred from the claim text.