Method of making grid array assembly

A method of making a grid array assembly including a printed circuit board containing multiple electrical circuits comprising:

• providing a series of boards including bonding pads and metallization on a first surface of each board and conductive vias in the board extending to a second opposite second surface of the board, said second surface containing an array of contact pads in contact with the vias, which boards have been tested and determined to be accepted boards;
• providing an elongated carrier strip having a series of aligned apertures extending longitudinally along the strip for mounting individual accepted boards;
• attaching an individual accepted board in each aperture;
• mounting an integrated circuit die including die conductive pads, on said first surface;
• bonding wire bonds from said die conductive pads to said bonding pads;
• encapsulating said die and said wire bonds against a portion of said first surface of the boards;
• removing a resultant grid array assembly, including the printed circuit board and encapsulated die from the carrier strip;
• in which the attaching comprises bonding side edges of the accepted boards in seriatim in each of said aligned apertures;
• wherein said encapsulating comprises providing a molding die including a molding cavity and a molding runner;
• closing and clamping the molding die including the molding cavity and molding runner on a peripheral surface of the carrier strip overlying said board portion;
• transferring a hardenable molding compound into the molding cavity, around said die and said wire bonds and onto said board portion;
• hardening the molding compound;
• unclamping and opening said molding die to remove the molding runner from the strip carrier;
• and
• in which said removing comprises singulating single grid array assemblies from the carrier strip.

A method of making a grid array assembly including a printed circuit board containing multiple electrical circuits comprising:

• providing a series of boards including bonding pads and metallization on a first surface of each board and conductive vias in the board extending to a second opposite second surface of the board, said second surface containing an array of contact pads in contact with the vias, which boards have been tested and determined to be accepted boards;
• providing an elongated carrier strip having a series of aligned apertures extending longitudinally along the strip for mounting individual accepted boards;
• attaching an individual accepted board in each aperture:
• mounting an integrated circuit die including die conductive pads, on said first surface;
• bonding wire bonds from said die conductive pads to said bonding pads;
• encapsulating said die and said wire bonds against a portion of said first surface of the boards;
• removing a resultant grid array assembly, including the printed circuit board and encapsulated die from the carrier strip;
• and
• further comprising providing an accepted board having a dimension on spaced opposite sides which is longer than one X-Y dimension of a finished grid array package and wherein the resultant areas attach the accepted board to the carrier strip.