Low profile optical device with multiple mounting configurations
AssigneeSiemens Microelectronics, Inc.
InventorsPaul-Martin Gerber, Marvin Lumbard
Life of this patent
Estimating the term…
Abstract
An optical send-receive module includes a frame which has a front section, a back side, and a top section. A lens carrier is attached to the front section of the frame. The lens carrier includes one or more lenses which face forward. An integrated circuit carrier is placed within the top section of the frame. First metal leads electrically connect components within the lens carrier to an integrated circuit within the integrated circuit carrier. Second metal leads extend from the integrated circuit carrier, along the top section of the frame, down the back side of the frame and are bent under the frame.
Claims16
An optical send-receive module comprising:
- a frame having a front, a back side, and a top section;
- a lens carrier attached to the front of the frame, the lens carrier including a lens which faces forward;
- an integrated circuit carrier placed within the top section of the frame;
- first metal leads which electrically connect components within the lens carrier to an integrated circuit within the integrated circuit carrier;
- and,
- second metal leads which extend from the integrated circuit carrier, along the top section of the frame, down the back side of the frame and extend under the frame.
A method for manufacturing an optical send-receive module comprising the following steps:
- (a) forming a frame, the frame having a front section, a back side, and a top section;
- (b) molding a lens carrier and a universal chip carrier, the lens carrier and universal chip carrier being co-planar and being connected by a first set of metal leads, a second set of metal leads extending out from the universal chip carrier;
- and,
- (c) placing the lens carrier and the universal chip carrier within the frame, wherein
- the lens carrier is attached to the front section of the frame, and the first set of metal leads are bent so that a lens included within the lens carrier faces forward, and
- the second metal leads are bent so that they extend from the universal chip carrier, along the top section of the frame, down the back side of the frame and extend under the frame.
A module used for wireless communication, the module comprising:
- a frame having a front, a back side and a top section;
- a lens carrier attached to the front of the frame, the lens carrier including a lens which faces forward;
- an integrated circuit carrier placed within the top section of the frame;
- first metal leads which connect the lens carrier to an integrated circuit within the integrated circuit carrier;
- and,
- second metal leads which extend from the integrated circuit carrier, along the top section of the frame, down the back side of the frame and are bent under the frame.
Dependencies are inferred from the claim text.