Face-up semiconductor chip assembly
AssigneeTessera, Inc.
InventorsIgor Y. Khandros, Thomas H. Distefano
Life of this patent
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Abstract
A semiconductor assembly having contacts on a peripheral region of the top surface of a chip and a backing element overlying the bottom surface of the chip. The backing element has terminals such that at least some of the terminals overlie the bottom surface of the chip. Leads including bonding wires extending alongside the edges of the chip connect the contacts and the terminals. The terminals of the assembly are movable with respect to the chip.
Claims29
A semiconductor assembly comprising:
- a semiconductor chip having oppositely facing front and rear surfaces and edges extending between said front and rear surfaces, said chip further having contacts on a peripheral region of said front surface;
- a backing element having electrically conductive terminals and lead portions thereon, wherein said lead portions are connected to said terminals, said backing element overlying said rear surface of said semiconductor chip such that at least some of said terminals overlie said rear surface of said chip;
- bonding wires connected to said contacts on said front surface of said chip, said bonding wires extending downwardly alongside said edges of said chip and being connected to the lead portions on the backing element;
- wherein said terminals are movable with respect to said chip.
The semiconductor assembly as claimed in 21, wherein the encapsulant is compliant.
The semiconductor assembly as claimed in 26, wherein the encapsulant is compliant.
Dependencies are inferred from the claim text.