Plastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modes
AssigneeSGS-Thomson Microelectronics S.A.
InventorsRenato Poinelli, Mauro Mazzola
Life of this patent
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Abstract
A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate that is arranged on the bottom of the plastic package and has thinner ends, wherein the length of the heat sink plate is at least equal to the minimum length of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.
Claims15
A QFP plastic surface-mounting semiconductor power device, comprising
- a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from said plastic package, and a heat sink plate that is arranged on the bottom of said plastic package and has thinner ends, wherein a length of said heat sink plate is at most equal to a minimum length of said plastic package, channels being formed in said plastic package in a position that is adjacent to the thinner ends of said heat sink plate, wherein each of said channels includes two opposing channels that are adjacent to side edges of each one of the ends of said heat sink plate and inside said plastic package, said channels being adapted to allow the exposure of each one of said ends from said plastic package to avoid damage during the finishing of said power device.
A surface-mount semiconductor device, comprising:
- a plastic package including a top surface, a bottom surface and angled sides connecting the top and bottom surfaces, said package having channels disposed on opposing sides of said package, said package having a minimum length between the opposing sides along the bottom surface and a maximum length between the opposing sides intermediate the top and bottom surfaces;
- a heat sink plate that is arranged on the bottom surface of said package, said heat sink plate including a central portion and end portions extending from opposite sides of said central portion, said end portions being narrower than said central portion and disposed adjacent said channels so that said end portions are exposed, said heat sink plate having a length that is at most equal to the minimum length of said plastic package;
- a plurality of surface-mount terminals protruding from said package;
- and
- a chip disposed within said package and electrically connected to said terminals, said chip being mounted to said heat sink plate.
A surface-mount semiconductor device, comprising:
- a plastic package including a top surface, a bottom surface and sides connecting the top and bottom surfaces, said package having channels disposed on opposing sides of said package;
- a heat sink plate that is arranged on the bottom surface of said package, said heat sink plate including a central portion and end portions extending from opposite sides of said central portion, said end portions being narrower than said central portion and disposed adjacent said channels so that said end portions are exposed;
- a plurality of resting elements that protrude from the bottom surface of said plastic package and are configured to stabilize said package when placed inside a container for shipping said device;
- a plurality of surface-mount terminals protruding from the sides of said package;
- and
- a chip disposed within said package and electrically connected to said terminals, said chip being mounted to said heat sink plate.
Dependencies are inferred from the claim text.