Organosilicon-containing compositions having enhanced adhesive properties
AssigneeJohnson Matthey PLC
InventorMy N. Nguyen
Life of this patent
Estimating the term…
Abstract
Described is an organosilicon-containing composition with enhanced adhesive properties having about 10 to 80 wt. % of an organic compound component, about 20 to 90 wt. % of one of boron nitride or silver and at least about 0.1 wt. % carbon fibers. The component comprises the reaction product of about 40 to 90 wt. % of the reaction product of cyclic olefin and cyclic siloxane and about 10 to 60 wt. % rubber in liquid form.
Claims14
An organosilicon-containing composition suitable for use as an adhesive and capable of rapid curing at low temperature comprising about 10 to 80 wt. % of an organic compound component, about 20 to 90 wt. % of one of boron nitride and silver and at least about 0.1 wt. % carbon fibers;
- said organic compound component comprising the reaction product of about 40 to 90 wt. % reaction product of cyclic olefin and cyclic siloxane and about 10 to 60 wt. % rubber in liquid form.
Dependencies are inferred from the claim text.